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 MC74VHC1G132 2-Input NAND Schmitt-Trigger
The MC74VHC1G132 is a single gate CMOS Schmitt NAND trigger fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The MC74VHC1G132 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage. This allows the MC74VHC1G132 to be used to interface 5.0 V circuits to 3.0 V circuits. The MC74VHC1G132 can be used to enhance noise immunity or to square up slowly changing waveforms.
Features http://onsemi.com MARKING DIAGRAMS
5 1 SC-88A/SOT-353/SC-70 DF SUFFIX CASE 419A 5 VD M G G M 1 5 5 1 TSOP-5/SOT-23/SC-59 DT SUFFIX CASE 483 1 VD AYW G G
* * * * * * *
High Speed: tPD = 3.6 ns (Typ) at VCC = 5.0 V Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25C Power Down Protection Provided on Inputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 68; Equivalent Gates = 16 Pb-Free Packages are Available
VD = Device Code M = Date Code* A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.
IN B
1
5
VCC
PIN ASSIGNMENT
IN A 2 1 2 GND 3 4 OUT Y 3 4 5 IN B IN A GND OUT Y VCC
Figure 1. Pinout (Top View)
FUNCTION TABLE
Inputs A B L H L H Output Y H H H L
IN A IN B
&
OUT Y
Figure 2. Logic Symbol
L L H H
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2005
1
August, 2005 - Rev. 17
Publication Order Number: MC74VHC1G132/D
MC74VHC1G132
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 125C (Note 5) SC70-5/SC-88A (Note 1) TSOP-5 SC70-5/SC-88A TSOP-5 Parameter Value *0.5 to )7.0 -0.5 to +7.0 *0.5 to VCC )0.5 -20 $20 $12.5 $25 *65 to )150 260 )150 350 230 150 200 Level 1 UL 94 V-0 @ 0.125 in u2000 u200 N/A $500 V Unit V V V mA mA mA mA C C C C/W mW
ILATCHUP
Latchup Performance
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA tr , tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Parameter Min 2.0 0.0 0.0 *55 - - Max 5.5 5.5 VCC )125 No Limit No Limit Unit V V V C ns/V
NORMALIZED FAILURE RATE
Device Junction Temperature versus Time to 0.1% Bond Failures
Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0
FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130 C TJ = 120 C TJ = 110 C TJ = 100 C TJ = 80 C 100 TIME, YEARS TJ = 90 C
1 1 10 1000
Figure 3. Failure Rate vs. Time Junction Temperature
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MC74VHC1G132
DC ELECTRICAL CHARACTERISTICS
VCC (V) 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VIN = VCC or GND VIN = VIH or VIL IOH = -50 mA IOH = -4 mA IOH = -8 mA VOL Maximum Low-Level Output Voltage VIN = VIH or VIL IOL = 50 mA IOL = 4 mA IOL = 8 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current VIN = 5.5 V or GND VIN = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to 5.5 5.5 TA = 25C Min 1.50 2.35 2.80 0.65 1.10 1.45 0.30 0.40 0.50 1.9 2.9 4.4 2.58 3.94 0.0 0.0 0.0 0.1 0.1 0.1 0.36 0.36 0.1 1.0 Typ 1.88 2.66 3.21 1.03 1.62 2.02 0.85 1.05 1.20 2.0 3.0 4.5 Max 2.25 3.10 3.70 1.40 2.10 2.60 1.60 2.00 2.25 TA 85C Min 1.50 2.35 2.80 0.65 1.10 1.45 0.30 0.40 0.50 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 1.0 20 Max 2.25 3.10 3.70 1.40 2.10 2.60 1.60 2.00 2.25 -55 TA 125C Min 1.50 2.35 2.80 0.65 1.10 1.45 0.30 0.40 0.50 1.9 2.9 4.5 2.34 3.66 0.1 0.1 0.1 0.52 0.52 1.0 40 V V Max 2.25 3.10 3.70 1.40 2.10 2.60 1.60 2.00 2.25 Unit V
Symbol VT+
Parameter Positive Threshold Voltage Negative Threshold Voltage Hysteresis Voltage
Test Conditions
VT-
V
VH
V
VOH
Minimum High-Level Output Voltage IOH = -50mA
V
V mA mA
I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I I II I I II I I I I I II I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII I I I I I I II I I I I I II II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIII II IIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII I I II I I I I I II I IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII I I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns
Symbol tPLH, tPHL Parameter Test Conditions Min TA = 25C Typ 4.6 6.1 3.6 4.3 5.5 TA 85C -55 TA 125C Min 1.0 1.0 1.0 1.0 Max Max Min 1.0 1.0 1.0 1.0 Max Unit ns Maximum Propagation Delay, A or B to Y VCC = 3.3 0.3 V VCC = 5.0 0.5 V CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF 11.9 15.4 7.7 9.7 10 14.0 17.5 9.0 11.0 10 16.1 19.6 10.3 12.3 10 CIN Maximum Input Capacitance pF Typical @ 25C, VCC = 5.0 V 11 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74VHC1G132
TEST POINT A or B 50% GND tPLH Y tPHL DEVICE UNDER TEST VCC OUTPUT CL*
50% VCC *Includes all probe and jig capacitance
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number MC74VHC1G132DFT1 M74VHC1G132DFT1G MC74VHC1G132DFT2 M74VHC1G132DFT2G MC74VHC1G132DTT1 M74VHC1G132DTT1G Package Type SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SOT23-5/TSOP-5SC59-5 SOT23-5/TSOP-5SC59-5 (Pb-Free) Tape and Reel Size 178 mm (7 in) 3000 Units / Tape & Reel 178 mm (7 in) 3000 Units / Tape & Reel 178 mm (7 in) 3000 Units / Tape & Reel 178 mm (7 in) 3000 Units / Tape & Reel 178 mm (7 in) 3000 Units / Tape & Reel 178 mm (7 in) 3000 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC74VHC1G132
PACKAGE DIMENSIONS
SC-88A / SOT-353 / SC70 CASE 419A-02 ISSUE H
A G
5
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
S
1 2 3
-B-
DIM A B C D G H J K N S
D 5 PL
0.2 (0.008)
M
B
M
N J C
INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087
MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
mm inches
1.9 0.0748
SCALE 20:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MC74VHC1G132
PACKAGE DIMENSIONS
TSOP-5 / SOT23-5 / SC59-5 DT SUFFIX CASE 483-02 ISSUE D
D
5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
S
B
L G A J C 0.05 (0.002) H K M
DIM A B C D G H J K L M S
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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6
MC74VHC1G132/D


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